Gold plating
We maintain the gold plating for two pivotal purposes. First of them is to format a functional, technical coating of pure 24 carat gold without organic compounds (brighteners). This is mainly used in electronics and microelectronics. High conductivity and excellent chemical resistance compared to the silver utilize gold plating to usage as an electronic top coat that is inert to all outer corrosive actions. That is why the thin gold layer is often use for covering and long time protection of important contacts e.g. in microprocessors. Secondly the gold plating can be used for decorative and representative purposes and for this issue the bath contains additional chemical compounds as a brightener. These are subservient mainly for covering of tiny objects, promotion gift items, fashion accessories and jewellery.
Layer properties
- Well conductive, solderable coating with excellent chemical resistance and long lifetime.
- Soft, flexile and ductile coating (possibility of additional hardening by doping e.g. by nickel)
- Precious layer with an exclusive and attractive appearance suitable for promotion and decorative purposes.
Deposition - dimension
- 0,5 - 3 μm - technical application
- > 10 μm - decorative purposes
Way of processing
- Barrel plating
- Rack plating (only laboratory amount)
Basic material - substrate:
- Copper + Cu alloys (technical coating, Ni underlayer)
- Stainless steel (decorative coating, Ni underlayer)
Application field:
- Electronics - contacts, connectors.
- Vacuum systems - vacuum tubes and other components
- Decorative coating - watch cases, glasses' frames, jewellery, promotion gifts etc.